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Equipment

 

 Equipment

Control panel

Electron Beam Evaporator 1. Thin Films Evaporator
2. Kinds of Substrate :glass and wafer
3. Substrate Sizes : 2 ”、 4 ”、 6 ”
4. Kinds of Target : Ti 、 Cr 、 Ag 、 Al 、 Ni 、 Au
5. The Velocity of Minimum Evaporator : 0.1 A /S

Electron Cyclotron Resonance Chemical Vapor Deposition 1. Surface plasma treatment (H 2 plasma, N 2 plasma, NH 3 plasma
2. For Carbon Nanotubes Synthesis (Carbon feedstock: CH 4 and C 3 H 8 , Substrate can be heated up to 800 o C)

Sputter System nano film deposition

1.CD-RW 、 DVD-RW 、 metal and oxide coating
2.TN/STN-color filter ITO SiO2 film
3.MEMS process
4.Ni-Cr coating for chip resister
5.Al-Si coating for IC driver


ION MILLING

Checkout equipment


Atomic Force Microscopy(AFM) Burleigh Instruments (UK) Ltd. - METRIS 2001

Ultraviolet/Visible Spectrophotometer
(UV/Vis Spectrophotometer) Hitachi Instruments, Inc. - U-3310

FEG-STEM( Philips Tecnai G2 F20 FEG-STEM)


Scanning Electron Microscopy 

1.Surface Topography Observations (magnification of 30X to 100,000X )
2.Chemical Composition Identification and Quantitative Analyses (Detect Limits Z 3 5)
3.Material Failure Analyses
4.Quality Reliability & Production Process Evaluation
5.Biological Specimen (Natural-SEM)


JEOL JEM-1230 120 KV TEM 

   1. Organic-Inorganic Hybrid Particle    

   2. Observation of Organic Particle

   3. Measurement of Nano-Particle

   4.  Replica of Nano-Particle


 
FE-SEM (JEOL JSM-6701F)

VSM

Vibrating Sample Magnetometet

 X- RAY

D2 XRD

(Bruker D2 PHASER)


 


Inversion Fluorescence Microscope 

1. Cell morphology observation
2. DNA molecule observation
3. Protein molecule observation


Fourier Transform Infrared spectrometer

 1. Test items: Molecular rotational absorbance/transmittance or vibrational absorbance/transmittance
2. Test methods: Transmission or reflectance
3. Test samples: Solid or liquid


    

BRUKER-NMR 400MHz

1.一般氫譜 1D 1 H ( < 0.5 hr)

2.一般去氫偶合碳譜 1D 13 C (0.5-5 hr 或 overnight)

3.1D-DEPT( Distortionless Enhancement by Polarization Transfer )

4.H-H-COSY (Correlation Spectroscopy) :

5.2D-HMQC (HeteronuclearMultiple QuantumCorrelation) 

6.2D-HMBC (Heteronuclear Multiple Bond Correlation) 

 


  Electron-Gun evaporation system

Plasma Enhanced Chemical Vapor Deposition system(PECVD)

Metal Organic Chemical Vapor Deposition system(MOCVD)

  CV map systems Four Dimensions, Inc. - CV map 92a

 

Highly Accelerated Stress Test (HAST)

Test Chamber : DI400xD550mm 2 , auto control.
Humidity : RH30% ~100% ± 1%
Temperature : 105~170 ℃ ± 0.5 ℃
Pressure : 0.2~2.2kg/cm 2 ± 0.5%
Continuous test : 500hr


Four-point probe mapping system Four Dimensions, Inc. - MODEL 280SI

Wafer or square wafer maximum size : 8″ wafer or 6″ x 6″ square wafer
Sheet resistance range : 1m Ω /square ~ 800K Ω /square